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NXP Semiconductors
Table 10.
IP4352CX24
9-channel SD memory card interface filter with ESD protection
Characteristics
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
T reflow(peak) peak reflow temperature
230
-
260
° C
t 1
t 2
t 3
t 4
t 5
dT/dt
time 1
time 2
time 3
time 4
time 5
rate of change of
temperature
soak time
time during T ≥ 250 ° C
time during T ≥ 230 ° C
time during T > 217 ° C
cooling rate
pre-heat
60
-
10
30
-
-
2.5
-
-
-
-
-
-
-
180
30
50
150
540
? 6
4.0
s
s
s
s
s
° C/s
° C/s
10. Abbreviations
Table 11.
Acronym
DECT
DUT
EMI
ESD
FR4
NSMD
PCB
PCS
RoHS
WLCSP
11. Revision history
Abbreviations
Description
Digital Enhanced Cordless Telecommunications
Device Under Test
ElectroMagnetic Interference
ElectroStatic Discharge
Flame Retard 4
Non-Solder Mask PCB Design
Printed-Circuit Board
Personal Communication System
Restriction of Hazardous Substances
Wafer-Level Chip-Scale Package
Table 12.
Revision history
Document ID
IP4352CX24_2
Release date
20100503
Data sheet status
Product data sheet
Change notice
-
Supersedes
IP4352CX24_1
Modifications:
?
?
?
?
?
Features, Applications and Legal information updated.
Figure 2 : Zener diode symbol added.
Figure 7 : Package outline changed.
Table 6 : updated.
Section 9 : Soldering information changed.
IP4352CX24_1
20090813
Product data sheet
-
-
IP4352CX24_2
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 02 — 3 May 2010
? NXP B.V. 2010. All rights reserved.
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